IPJQUMTP - 2602PJ

- Substrate: Silicon 220 nm (2 μm BOX)

- Includes 10 SEM images in total

- Includes 2.2 micron oxide cladding

- Includes custom dicing into 4 sub-dies in total

Oxide Window Openings (Dedicated)

- 100 +/- 50 nm of oxide remaining over features

Total Cost:  $3,744.00

FABrIC Contribution, managed by CMC:  $1,310.40

Researcher Contribution, with FABriC Membership & Research Subscription:  $2,433.60

$2,433.60

2601LE - ILEWTPIN

2  - 20mm x 20mm tiles subdiced as follows:

• ILEWTPIN
• ILEWTMBS
• ILEWTTRI

CMC will provide one-time support of the sub-dicing costs ($500.00).  

$4,226.00

2601LE - ILEQUMW2

2  - 20mm x 20mm tiles 

Student - Monica Wasfy / Faculty - Yahia Antar

$4,226.00

IPJQUWHI - 2602PJ

Substrate: Silicon 220 nm (2 μm BOX)

- Waveguide area: 0.77 mm2

- Includes 10 SEM images in total

Total Cost:  $1,861.00

FABrIC Contribution, managed by CMC:  $651.35

Researcher Contribution, with FABriC Membership & Research Subscription:  $1,209.65

$1,209.65

IPJMGJOE - 2604PJ

NanoSOI Photonics Fabrication Service - MPW Submission # 2372

- Substrate: Silicon 220 nm (2 μm BOX)

- Layout Name: IPJMGJOE_2604PJ (IPJMGJOE_8ITg4pc.GDS)

- Includes 2.2 micron oxide cladding

- Includes tri-layer metallization

- Includes deep trenches for edge coupling

Total Cost:  $3,302.00

FABrIC Contribution, managed by CMC:  $1,155.70

Researcher Contribution, with FABrIC Membership & Research Subscription:  $2,146.30

$2,416.30

IPJMG198 - 2603PJ

NanoSOI Photonics Fabrication Service - MPW Submission # 2321

• - Substrate: Silicon 220 nm (2 μm BOX)
• - Layout Name: IPJMG198 (IPJMG198_2603PJ_v3_4LuzR4k.GDS)
• - Includes 2.2 micron oxide cladding
• - Includes tri-layer metallization
• - Includes deep trenches for thermal isolation trenches

Total Cost: $3,334.00

FABrIC Support, managed by CMC: $1,166.90

Research Contribution, with research subscription:  $2,167.10

$2,167.10

IPJRSNP1 - 2606PJ

NanoSOI Photonics Fabrication Service - MPW Submission # 2459

- Substrate: Silicon 220 nm (2 μm BOX)

- Includes 2.2 micron oxide cladding

- Includes tri-layer metallization

Electrical Packaging of MPW Submission # 2459

- Wire bonding of PIC to standard ANT PCB

- Includes TEC and thermistor and ribbon cable interface

Optical Packaging of MPW Submission # 2459

- 2 x 8-port fiber array using polarization-maintaining (PMF) fibers

- FC/APC fiber connectors

Total Cost: $9.057.00

FABrIC Contribution, managed by CMC:  $3,169.95

Researcher Contribution, with FABriC Membership and Research Subscription: $5,887.05

$5,887.05

IPJRSNP2 - 2606PJ

NanoSOI Photonics Fabrication Service - MPW Submission # 2460

- Substrate: Silicon 220 nm (2 μm BOX)

- Includes 2.2 micron oxide cladding

- Includes tri-layer metallization

Electrical Packaging of MPW Submission # 2459

- Wire bonding of PIC to standard ANT PCB (includes TEC and thermistor)

Total Cost: $3,935.00

FABrIC Contribution, managed by CMC:  $1,377.25

Researcher Contribution, with FABriC Membership and Research Subscription: $2,557.75

$2,557.75

2602CF - ICFMGCPX 0.18µm CMOS (TSMC)

Design Size:  1mm x 2mm2 / Run Date: April 1, 2026

Faculty:  Gordon Roberts / Student: Yushu Zhao

$2,316.00

IDATR003 - 2601DA (MPW2277)

CMC Run Code:  2601DA - Run Code: 2026-02-11.

Design Size: 1 x 1.2mm2

Faculty: Xilin Liu / Student: Richard Zeng

$21,096.00

ICYDTQSP - 2602CY 65nm CMOS LP (TSMC)

Design Size: 1mm x 1mm

Faculty:  Jean-Francois Bousquet 

$5,375.00

ICSCARFS - 2602CS 65nm CMOS GP (TSMC)

Design Size: 1mm x 1mm - Run Date:  April 15, 2026

Faculty:  Glenn Cowan / Student:  Reyane Saber

$5,375.00