NanoSOI Photonics Fabrication Service - MPW Submission # 2321
- - Substrate: Silicon 220 nm (2 μm BOX)
- - Layout Name: IPJMG198 (IPJMG198_2603PJ_v3_4LuzR4k.GDS)
- - Includes 2.2 micron oxide cladding
- - Includes tri-layer metallization
- - Includes deep trenches for thermal isolation trenches
Total Cost: $3,334.00
FABrIC Support, managed by CMC: $1,166.90
Research Contribution, with research subscription: $2,167.10
