NanoSOI Photonics Fabrication Service - MPW Submission # 2459
- Substrate: Silicon 220 nm (2 μm BOX)
- Includes 2.2 micron oxide cladding
- Includes tri-layer metallization
Electrical Packaging of MPW Submission # 2459
- Wire bonding of PIC to standard ANT PCB
- Includes TEC and thermistor and ribbon cable interface
Optical Packaging of MPW Submission # 2459
- 2 x 8-port fiber array using polarization-maintaining (PMF) fibers
- FC/APC fiber connectors
Total Cost: $9.057.00
FABrIC Contribution, managed by CMC: $3,169.95
Researcher Contribution, with FABriC Membership and Research Subscription: $5,887.05
