NanoSOI Photonics Fabrication Service - MPW Submission # 2460
- Substrate: Silicon 220 nm (2 μm BOX)
- Includes 2.2 micron oxide cladding
- Includes tri-layer metallization
Electrical Packaging of MPW Submission # 2459
- Wire bonding of PIC to standard ANT PCB (includes TEC and thermistor)
Total Cost: $3,935.00
FABrIC Contribution, managed by CMC: $1,377.25
Researcher Contribution, with FABriC Membership and Research Subscription: $2,557.75
