FAB: ANT_SOI_Fabrication

IPJMG198 - 2603PJ

NanoSOI Photonics Fabrication Service - MPW Submission # 2321

• - Substrate: Silicon 220 nm (2 μm BOX)
• - Layout Name: IPJMG198 (IPJMG198_2603PJ_v3_4LuzR4k.GDS)
• - Includes 2.2 micron oxide cladding
• - Includes tri-layer metallization
• - Includes deep trenches for thermal isolation trenches

Total Cost: $3,334.00

FABrIC Support, managed by CMC: $1,166.90

Research Contribution, with research subscription:  $2,167.10

$2,167.10

IPJRSNP1 - 2606PJ

NanoSOI Photonics Fabrication Service - MPW Submission # 2459

- Substrate: Silicon 220 nm (2 μm BOX)

- Includes 2.2 micron oxide cladding

- Includes tri-layer metallization

Electrical Packaging of MPW Submission # 2459

- Wire bonding of PIC to standard ANT PCB

- Includes TEC and thermistor and ribbon cable interface

Optical Packaging of MPW Submission # 2459

- 2 x 8-port fiber array using polarization-maintaining (PMF) fibers

- FC/APC fiber connectors

Total Cost: $9.057.00

FABrIC Contribution, managed by CMC:  $3,169.95

Researcher Contribution, with FABriC Membership and Research Subscription: $5,887.05

$5,887.05

IPJRSNP2 - 2606PJ

NanoSOI Photonics Fabrication Service - MPW Submission # 2460

- Substrate: Silicon 220 nm (2 μm BOX)

- Includes 2.2 micron oxide cladding

- Includes tri-layer metallization

Electrical Packaging of MPW Submission # 2459

- Wire bonding of PIC to standard ANT PCB (includes TEC and thermistor)

Total Cost: $3,935.00

FABrIC Contribution, managed by CMC:  $1,377.25

Researcher Contribution, with FABriC Membership and Research Subscription: $2,557.75

$2,557.75