ICSTRPNS - 2506CS - Packaging

ICSTRPNS – 10 of CPGA209

1. Assembly Charges:  $5,469.00
2. CPGA209 Package w/lid: $122.50each @ 10 pieces = $1,225.00
3. Total charge for 10 parts packaged: $6,694.00
1. FABrIC Support, managed by CMC: $2,342.90
2. Researcher Contribution with FABrIC Membership and Research Subscription: $4,351.10

$4,351.10

IDJMOYC1 - 2503DJ - Packaging

20 dies packaged in QFN68 packages w/lids

$3,281.00

ICMDTNRC - Packaging

ICMDTNRC – 17 of CPGA85

• Assembly Charges:  $3,726.00
• CPGA85 Package w/lid: $34.00 @ 17 pieces = $578.00
• Total charge for 17 parts packaged: $4,304.00
• FABrIC Support, managed by CMC: $1,506.40
• Researcher Contribution with FABRiC Membership and Research Subscription: $2,797.60

$2,797.60

Cornell 3D Integration - Custom_Packaging_010130

Custom_Packaging_010130
Two-Tier 3D Integration

1-NRC for Project Management / Design / Mask Fabrication / Tooling / Shipment

2-Cu Pillar Bump on Top Die Wafer Processing:

• Batch setup
• Pillar bump process: Seed layer deposition + lithography + electroplating + resist/seed layer removal
• Wafer thinning
• Wafer dicing
• Die sorting for flip chip assembly

3-UBM on Bottom Die Wafer Processing:

• -atch setup
• UBM process: seed layer deposition + lithography + electroplating + resist/seed layer removal
• Wafer thinning
• Wafer dicing
• Die sorting for flip chip assembly

4-Flip Chip Assembly of 1×1 Die Modules

• Setup of bonding process (approx. 5–10 setup modules plus analysis)
• Flip chip assembly of modules: 30 modules + spares
• Optical microscope / X-ray inspection and documentation

5-Packaging of 3D Chip:

• COB or Wire-bonded Standard Package 

$52,500.00