Custom_Packaging_010130
Two-Tier 3D Integration
1-NRC for Project Management / Design / Mask Fabrication / Tooling / Shipment
2-Cu Pillar Bump on Top Die Wafer Processing:
-Batch setup
-Pillar bump process: Seed layer deposition + lithography + electroplating + resist/seed layer removal
-Wafer thinning
-Wafer dicing
-Die sorting for flip chip assembly
3-UBM on Bottom Die Wafer Processing:
-Batch setup
-UBM process: seed layer deposition + lithography + electroplating + resist/seed layer removal
-Wafer thinning
-Wafer dicing
-Die sorting for flip chip assembly
4-Flip Chip Assembly of 1×1 Die Modules
-Setup of bonding process (approx. 5–10 setup modules plus analysis)
-Flip chip assembly of modules: 30 modules + spares
-Optical microscope / X-ray inspection and documentation
5-Packaging of 3D Chip:
-COB or Wire-bonded Standard Package
