Integration Packaging and Assembly

IDJSAJW1 - Packaging

Assy_Ceramic, CPGA68 Wires, 20 Units. Includes; die attach, wirebond, encapsulation, and

hand marking, including empty packages.

$3,445.00

IDJMOYC1 - 2503DJ - Packaging

20 dies packaged in QFN68 packages w/lids

$3,281.00

ICFWTNA2 – COB Packaging

 

ICFWTNA2 –

• Total Cost: Qty 5 – COB /SMT:  $4,488.00

• FABrIC Support, managed by CMC: $1,570.80
• Researcher Contribution, with FABrIC Membership and Research Subscription: $2,917.20

$2,917.20

ICFWTNA2 – COB Packaging

 

ICFWTNA2 –

• Total Cost: Qty 5 – COB /SMT:  $4,488.00

• FABrIC Support, managed by CMC: $1,570.80
• Researcher Contribution, with FABrIC Membership and Research Subscription: $2,917.20

$2,917.20

ICMDTNRC - Packaging

ICMDTNRC – 17 of CPGA85

• Assembly Charges:  $3,726.00
• CPGA85 Package w/lid: $34.00 @ 17 pieces = $578.00
• Total charge for 17 parts packaged: $4,304.00
• FABrIC Support, managed by CMC: $1,506.40
• Researcher Contribution with FABRiC Membership and Research Subscription: $2,797.60

$2,797.60

Cornell 3D Integration - Custom_Packaging_010130

Custom_Packaging_010130
Two-Tier 3D Integration

1-NRC for Project Management / Design / Mask Fabrication / Tooling / Shipment

2-Cu Pillar Bump on Top Die Wafer Processing:

• Batch setup
• Pillar bump process: Seed layer deposition + lithography + electroplating + resist/seed layer removal
• Wafer thinning
• Wafer dicing
• Die sorting for flip chip assembly

3-UBM on Bottom Die Wafer Processing:

• -atch setup
• UBM process: seed layer deposition + lithography + electroplating + resist/seed layer removal
• Wafer thinning
• Wafer dicing
• Die sorting for flip chip assembly

4-Flip Chip Assembly of 1×1 Die Modules

• Setup of bonding process (approx. 5–10 setup modules plus analysis)
• Flip chip assembly of modules: 30 modules + spares
• Optical microscope / X-ray inspection and documentation

5-Packaging of 3D Chip:

• COB or Wire-bonded Standard Package 

$52,500.00

Custom_Packaging_010132_Bumping_NRC

Non Recurring Costs

Includes: mask layout, mask procurement, and NRE process optimization.

SAC details:

-Bump diameter: 100 um

-Bump pitch: 200 um

$12,200.00

Custom_Packaging_010132_Bumping

Wafer Bumping

$3,900.00

Custom_Packaging_010132_Thinning

Back-grinding per wafer

$1,100.00

Custom_Packaging_010132_Singulation

Die singulation per wafer

$1,150.00

Custom_Packaging_010132_Sorting

Pick and place Wafer 1 to tape and reel and 60 die from Wafer 2 to waffle pack. The remainder of wafer 2 to ship on ring in shipper.

Includes 8" film frame shipper and wafer ring.

Split lot into 4 tapes -

Design #1 = dies # 1-6,

Design #2 = dies # 7-30,

Design #3 = dies #31-36,

Design #4 = dies # 37-42.

$6,850.00

ICSCARFS – 20 of QFN32

• Assembly Charges:  $2,632.00
• QFN Package w/lid: $34.80 each @ 20 pieces = $696.00
• Total charge for 20 parts packaged: $3,328.00

• FABrIC Support, managed by CMC: $1,164.8
• Researcher Contribution with FABrIC Membership and Research Subscription: $2,163.20

$2,163.20