2501PH - AMF Si Photonics MPW 7.4 x 3 Block
- Design Names:
- IPHTO001 - University of Trento
- IPHTK001 - Technical University of Denmark
- IPHDTDT2 - TU Dresden
IDJH1PB2 - 2603DJ (MPW2280)
GF 22FDX/FDX+ FDSOI 22nm - MPW
Design Area: 3mm x 2.5mm
Delivery: 100 untested die
$191,670.00IDJHIPB3 - 2603DJ (MPW2280)
GF 22FDX/FDX+ FDSOI 22nm - MPW
Design Area: 3mm x 3mm
Delivery: 100 untested die
$230,004.002601PH - IPHA70W0
AMF Si Photonics MPW 7.4 x 3 block
This 22mm2 design space will deliver approx. 20 diced chips to the customer.
$31,621.00ANT - NanoSOI Photonics Fabrication Service - MPW Submission # 2332
- Substrate: Silicon 220 nm (2 μm BOX) - Layout Name: TII_May12 (ANT4_SOI_20May2026_corrected_ONiIXTB.gds) - Waveguide area: 0.97 mm2 - Includes 595 SEM images in total - Includes 2.2 micron oxide cladding - Includes tri-layer metallization - Includes deep trenches for edge coupling - Includes custom dicing into 4 sub-dies in total - 3 hours engineering support
$11,934.00ANT - NanoSOI Photonics Fabrication Service - MPW Submission # 2332
- Substrate: Silicon 220 nm (2 μm BOX) - Layout Name: TII_May12 (ANT4_SOI_20May2026_corrected_ONiIXTB.gds) - Waveguide area: 0.97 mm2 - Includes 595 SEM images in total - Includes 2.2 micron oxide cladding - Includes tri-layer metallization - Includes deep trenches for edge coupling - Includes custom dicing into 4 sub-dies in total - 3 hours engineering support
$11,934.00