Integration Packaging and Assembly

ICYDTQSP – 2402CY -10 of 24CQFP

• Assembly Charges:  $2,729.00
• 24CQFP Package w/lid: $34.00 each @ 10 pieces = $340.00
• Total charge for 10 parts packaged: $3,069.00
• FABrIC Support, managed by CMC: $1,074.15
• Researcher Contribution with FABrIC Membership and Research Subscription: $1,994.85

$1,994.85

University of Minnesota 3D Integration - Custom_Packaging_010130

Custom_Packaging_010130
Two-Tier 3D Integration

1-NRC for Project Management / Design / Mask Fabrication / Tooling / Shipment

2-Cu Pillar Bump on Top Die Wafer Processing:

• Batch setup
• Pillar bump process: Seed layer deposition + lithography + electroplating + resist/seed layer removal
• Wafer thinning
• Wafer dicing
• Die sorting for flip chip assembly

3-UBM on Bottom Die Wafer Processing:

• -Batch setup
• UBM process: seed layer deposition + lithography + electroplating + resist/seed layer removal
• Wafer thinning
• Wafer dicing
• Die sorting for flip chip assembly

4-Flip Chip Assembly of 1×1 Die Modules

• Setup of bonding process (approx. 5–10 setup modules plus analysis)
• Flip chip assembly of modules: 30 modules + spares
• Optical microscope / X-ray inspection and documentation

5-Packaging of 3D Chip:

• COB or Wire-bonded Standard Package 

$52,500.00