Integration Packaging and Assembly

ICSCARFS – 20 of QFN32

• Assembly Charges:  $2,632.00
• QFN Package w/lid: $34.80 each @ 20 pieces = $696.00
• Total charge for 20 parts packaged: $3,328.00

• FABrIC Support, managed by CMC: $1,164.8
• Researcher Contribution with FABrIC Membership and Research Subscription: $2,163.20

$2,163.20

Custom_Packaging_010132_EVAL_PCB

Design and fabrication of a connector-interfaced eval-board for the test chips.

Includes NRE for the design, fabrication of 5 boards, and assembly of the interposer carriers on the eval boards.

$9,125.00

Custom_Packaging_010132_Interposer

Design a socket-style interposer for bumped-die testing. The interposer to be solder balled and assembled to the eval board.

Includes: NRE for design and fabrication of 5 carriers.

$12,540.00

Custom_Packaging_010132_MCP_EVAL_PCB

Design and fabrication of a connector-interfaced eval-board for the test chips.

Includes NRE for the design, fabrication of 5 boards, and assembly of the Multi-Chip interposer carriers on the eval boards.

$4,500.00

Custom_Packaging_010132_MCP_Interposer

Design a socket-style interposer for Multi-Chip bumped-dies testing. The interposer to be solder balled and assembled to the eval board.

Includes: NRE for design and fabrication of 4 carriers.

$6,580.00

ICSTR262 - 2603CS - 50 of QFN32

• Assembly Charges:  $2,962.00
• QFN32 Package w/lid: $25.10 each @ 50 pieces = $1,255.00
• Total charge for 50 parts packaged: $4,217.00
• FABrIC Support, managed by CMC: $1,475.95
• Researcher Contribution with FABrIC Membership and Research Subscription: $2,741.05

$2,741.05

Custom_Packaging_010132_Bumping_NRC

Non Recurring Costs

Includes: mask layout, mask procurement, and NRE process optimization.

SAC details:

-Bump diameter: 100 um

-Bump pitch: 200 um

$12,200.00

Custom_Packaging_010132_Bumping

Wafer Bumping

$3,900.00

Custom_Packaging_010132_Thinning

Back-grinding per wafer

$1,100.00

Custom_Packaging_010132_Singulation

Die singulation per wafer

$1,150.00

Custom_Packaging_010132_Sorting

Pick and place Wafer 1 to tape and reel and 60 die from Wafer 2 to waffle pack. The remainder of wafer 2 to ship on ring in shipper.

Includes 8" film frame shipper and wafer ring.

Split lot into 4 tapes - Design #1 = dies # 1-6, Design #2 = dies # 7-30, Design #3 = dies #

31-36, and Design #4 = dies # 37-42.

$6,850.00

IDAYKX03– 2602DA - 5 of 85PGA

• Assembly Charges:  $3,726.00
• 85PGA Package w/lid: $34.00 each @ 5 pieces = $170.00
• Total charge for 5 parts packaged: $3,896.00
• FABrIC Support, managed by CMC: $1,363.60
• Researcher Contribution with FABRiC Membership and Research Subscription: $2,532.40

 

$2,532.40