IDKA6PS1 - 2601DK / GF MPW0380
GF 28nm - 4.2mm x 3.8mm
GLOBALFOUNDRIES 28nm process technology offers a HKMG platform to support logic, analog and RF.
Deliverable: 100 bare die
$193,004.28GF 28nm - 4.2mm x 3.8mm
GLOBALFOUNDRIES 28nm process technology offers a HKMG platform to support logic, analog and RF.
Deliverable: 100 bare die
$193,004.28GF 22FDX/FDX+ FDSOI 22nm - MPW (min area 4mm2)
GLOBALFOUNDRIES (GF) 22FDX 22 nm Fully-Depleted Silicon-on-Insulator (FD-SOI)
process technology platform for low power embedded applications. The 22 nm FD-SOI
transistor technology delivers FinFET-like performance with energy-efficiency. The
simultaneous high Ft /high Fmax, high self-gain and high current efficiency of 22FDX enables
ultra low power analog/RF/mmWave designs.
Delivery of 100 untested dies
Minimum area required 4mm2, price per mm2.
$191,670.00Dimensions: 3.5mm x 1.72mm
GF 22FDX/FDX+ FDSOI 22nm - MPW
Delivery of 100 untested dies
$108,341.94GF 22FDX FDSOI 22nm - MPW
GLOBALFOUNDRIES (GF) 22FDX 22 nm Fully-Depleted Silicon-on-Insulator (FD-SOI) process technology platform
Design Size: 1mm x 1mm
Delivery of 100 untested dies
Design Size: 5mm x 5mm
GLOBALFOUNDRIES silicon photonics solution built on 45 nm technology (GF45CLO)
Deliverable: 100 bare die
$256,360.00Design Dimensions: 3mm x 2mm
SG3.3V, 5 Metal Layers, 9K Top Metal with MIM 2fF @ TM-1/TM
Deliverable: 100 Loose Die
$3,984.00FEDEX Charges (France - Canada): $163.64 US ($223.91 CAD)
Brokerage Fee to reissue Canadian Export Declaration: $18.27 USD ($25.00 CAD)
$181.91NRE price for 65PKG-25SI Dedicated Run Based on 6ML: ZX, IA, XA, IB, XB, IC. 2.5D interposer Starts with 8X metal BEOL Addendum Only - no gates Complexity: 300MM-65NM-65PKG25
$41,340.00Engineering wafer price for quoted 65PKG dedicated run Order size of 6+ wafers
$1,740.00GF 180MCU
Design Dimensions: 3mm x 3mm
Deliverables: 100 bare die
$5,850.00
