BGA-256 Design, Fabrication, and Assembly for an array of sensors
SOW Includes:
1. Two SG-BGA 8X8 0.5MM 16X16 Sockets
2. Multi-layer BGA-256 substrate design to route the sensor pads to the back-side BGA balls
3. 15 BGA substrates fabrication
4. 15 BGA-256 Tooling + Solder Balling 0.5mm
5. Host PCB Fabrication + SMT Assembly for Sockets and other components Invoicing Schedule: 100% to
be invoiced upon receipt of purchase order
Payment Terms: Net 30 days from date of invoice Terms of Delivery: Ex Works
All prices subject to change without notice.
Any applicable taxes, duties, tariffs, and/or brokerage fees are not included and are the
responsibility of the buyer.
Lead time: 10-12 weeks
