The Ansys Campus Solutions bundle provides access to the majority of offered Ansys software, including but not limited to Ansys Multiphysics, HFSS, Maxwell, SpaceClaim, FLUENT, and many more. It provides simulation capabilities for structural, thermal, fluid dynamics, explicit dynamics, electromagnetics and multiphysics solvers, Ansys Workbench, CAD import tools, solid modeling, 3-D full wave electromagnetic field (frequency and time domain), power and signal integrity, 3-D and 2-D parasitic extraction tools & solvers; high performance shared & distributed memory (HPC) solvers, advanced meshing, and post-processing features.
For more information on what is included in this bundle, please refer to the Ansys Academic Features Product Table at http://www.ansys.com/Products/Academic/Academic-Products-Features-Table.
All CMC Microsystems Canadian Academic account holders from a member university with a Prototyping or Designer Subscription are authorized to access this product. For more information, contact the Licensing Administrator at licensing@cmc.ca or 613-530-4787.
