Prepared by Jianzeng Xu, CMC Microsystems, and Alireza H.Mesgar, Polytechnique Montréal.
This application note demonstrates a flip-chip-based post processing fabrication technique for micromirror devices manufactured by the MEMSCAP MUMPs services available through CMC Microsystems.
The document is intended for researchers who conduct research employing micromirror or related MOEMS devices. Researchers with general interests in solder-free flip chip applications may also find it useful.
