This service provides access to silicon photonics chip-on-carrier wire bonding and on-chip surface grating coupling using pigtailed single mode fibres. The service is provided through the Tyndall National Institute, Ireland.
Features
- Standard footprint PCB carrier
- 20 DC connections
- Chip attach and wire bond assembly
- Single or double 8-channel fibre arrays
- Thermoelectric cooler (TEC)
Applications
Testing of silicon photonics device prototypes in a packaged form with permanent electrical and optical I/O interfaces.
Services:
- User Guide with chip design rules
- Packaging & assembly services
- Access to CMC engineering support
