This user guide describes chip design rules for prototyping level clients to access the packaging services provided by Tyndall National Institude, Ireland. It covers the following:
Configurations and specifications of the PCB-based chip carrier.
The process flow of CoC wire bonding and fiber grating coupling.
Design rules for the SOI waveguide chip.
All CMC Microsystem account holders with a Professor Research Subscription are authorized to access this document. For more information, contact licensing@cmc.ca or 613-530-4787.
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