The MEMS Integrated Design for Inertial Sensors (MIDIS™) platform is designed to provide a standard process for manufacturing accelerometers and gyroscopes and integrating them into an Inertial Measurement Unit (IMU) for consumer (mobile), automotive, and sports/health markets.
Features
- Getter free high vacuum sealing allows resonator Q factors > 20,000
- Efficient wafer level packaging minimizes overall die size
- 1.5-μm feature size in a 30-μm thick membrane
- Comb height control allows out-of-plane sensing
- TSV allows compact design ready for co-packaging
