Application Note: Characterization of Anisotropic Conductive Film Based on Vertical Fibers for Post-CMOS Wafer-Level Packaging

Prepared by Mamadou D. Diop and the DreamWafer® Research Team, in co-operation with CMC Microsystems.

This application note describes how an anisotropic conductive film (ACF) is used to provide vertical connections in a rapid system prototyping platform, the WaferBoardTM, without permanent bonding. It also explains how to perform mechanical and electrical tests to select the right ACF.

This document helps the researchers decide whether an ACF can satisfy their prototyping needs and how to select an ACF.

All CMC Microsystem account holders with a Professor Research Subscription are authorized to access this application note. For more information, contact our Licensing Administrator at licensing@cmc.ca or 613-530-4787.

Application Note: Characterization of Anisotropic Conductive Film Based on Vertical Fibers for Post-CMOS Wafer-Level Packaging

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