Prepared by:
- Abdolreza Rashidi Mohammadi, Postdoctoral Fellow, Mechanical Engineering Department, University of British Columbia, and
- Mu Chiao, Associate Professor, Mechanical Engineering Department, University of British Columbia;
in co-operation with CMC Microsystems.
This application note describes a robust packaging method for MEMS-based piezoresistive pressure sensors for applications of high-temperature and harsh environments found in industrial kraft pulp digesters.
The intended audience is the researchers who work on these applications and other applications of MEMS sensors.
All CMC Microsystem account holders with a Prototyping or Designer Subscription are authorized to access this application note. For more information contact Linda Dougherty at licensing@cmc.ca or 613-530-4787.
