Prepared by David Benfield and Jonathan Lueke, Ph.D. Candidates, and Walied Moussa, Ph.D., P.Eng, Advanced MEMS/NEMS Multiphysics Design Lab, Department of Mechanical Engineering, University of Alberta, in co-operation with CMC Microsystems.
This document outlines the general operation and process optimization of wire bonding and flip-chip assembly of MEMS devices. It also addresses specific challenges of device assembly on polyimide flexible printed circuit boards. It is intended for researchers who wish to develop similar prototype assembly capabilities in a university laboratory environment.
All CMC Microsystem account holders with a Professor Research Subscription are authorized to access this application note. For more information contact Linda Dougherty at licensing@cmc.ca or 613-530-4787.
