Prepared by Research group: DreamWafer TM Research Team: Mohammed Bougataya, PhD candidate, Université du Québec à Trois-Rivières, and Ahmed Lakhssassi Professor, Université du Québec en Outaouais, in Co-Operation with CMC Microsystems.
This application note presents a mixed fluid-heat transfer approach for thermal modeling and thermal analysis. The approach determines an equivalent convection coefficient and thermal boundary condition setting for a wafer-scale integrated circuit. The integrated circuit is implemented on an 8-inch silicon wafer plus an array of power devices attached to the backside of the wafer. The power devices are implemented on a copper PCB and AlN carrier. The wafer is 350 µm thick. Detailed thermal modeling and analysis is necessary due to the wafer’s thinness and the different thermal coefficients of expansion of the materials used. Thermal modeling and analysis ensures mechanical robustness of the wafer-scale integrated circuit and power devices, and the assembly’s proper operation under a range of conditions.
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