Prepared by Dr. Mohamed Fahmi and Dr. Raafat R. Mansour, Center for Integrated RF Engineering (CIRFE), Electrical and Computer Engineering Department, University of Waterloo; and Dr. Mojgan Daneshmand, Electrical and Computer Engineering Department, University of Alberta.
This application note describes the process of designing hermetically sealed Radio Frequency (RF) packages. The focus is on designing a packaging process that has minimal effects on the RF performance of the packaged RF components.
All CMC Microsystem account holders with a Subscription are authorized to access this application note. For more information contact Linda Dougherty at licensing@cmc.ca or 613-530-4787.
