Application Note: Implementation of High-Speed Chip-To-Chip Communication Links Using Die-On-Board Flip-Chip Technology

Prepared by Mike Bichan, Ph.D. candidate, Electrical Engineering, University of Toronto. 

This application note describes the implementation of high-speed chip-to-chip communication links using die-on-board flip-chip technology. Separate CMOS transmitter and receiver dies are to be flip-chip bonded to a FR-4 test PCB. The signal links are established through microstrip traces on board.

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Application Note: Implementation of High-Speed Chip-To-Chip Communication Links Using Die-On-Board Flip-Chip Technology

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