Prepared by Feng Liu, Digital Design Engineer, CMC Microsystems.
This application note describes a technique for directly mounting loose integrated circuit (IC) die on a non-conductive glass surface. This technique is primarily intended to facilitate the use of test probes, providing an appropriate IC packaging option at low cost with quick turnaround time.
All CMC Microsystem account holders with a Subscription are authorized to access this application note. For more information contact Linda Dougherty at licensing@cmc.ca or 613-530-4787.
