Prepared by Bob Stevenson, Senior Engineer, Microsystem Test, CMC Microsystems.
This application note briefly summarizes CMC’s experiences and insights (gained working with university researchers) in the use of polyimide (FLEX) materials for printed circuit boards (PCBs). It is intended as a collection of guidelines and suggestions and should not be used as a complete guide on the design of PCBs.
All CMC Microsystem account holders with a Subscription are authorized to access this application note. For more information contact Linda Dougherty at licensing@cmc.ca or 613-530-4787.
