Prepared by Patricia Greig, Photonics Lab Engineer, CMC Microsystems.
This application note provides guidelines that address the design flow, manufacture, and test of a high-speed radio frequency (RF) substrate that is intended for operation above 5 GHz. We describe CAD tool considerations, key concepts relating to the selection of substrate materials, circuit design considerations such as grounding and noise splitting, the procedure to attach die to substrate, and recommendations for wirebonding, device protection and testing.
All CMC Microsystem account holders with a Subscription are authorized to access this application note. For more information contact Linda Dougherty at licensing@cmc.ca or 613-530-4787.
