Developed with Dr. John Cartledge, Professor, Electrical and Computer Engineering, Queen’s University.
This application note describes how to specify the assembly requirements of a DC-operated, mid-infrared wavelength, edge-emitting laser diode in an industry-standard 14-pin butterfly package. We describe package performance requirements and the associated manufacturing specifications.
The intended audience includes researchers who require a controlled environment for characterizing their chip-level device, who may be experts in optoelectronics component design, but have little or no experience in device packaging.
All CMC Microsystem account holders with a Subscription are authorized to access this application note. For more information contact Linda Dougherty at licensing@cmc.ca or 613-530-4787.
