This application note was prepared for CMC by Yahya Hosseini, Masters Student, Electrical and Computer Engineering, University of Calgary. It describes the following:
- Preparing a CMOS chip and glass substrate for flip-chip bonding.
- Using the Smart Equipment Technology SAS FC150 flip-chip bonder to bond a CMOS sensor chip with indium-lead solder bumps onto a glass microfluidic network with gold surface metallization.
- The bond cycle parameters and bonding procedure used in this application.
CMC is collaborating with researchers at Canadian universities to build a library of microsystems application notes. These documents are intended to help extend microsystems research in Canada by describing new techniques, processes, and design tools relating to microsystems, and to help stimulate new ideas that accelerate research and development activities.
