The document includes a description of the service procedure that users follow when accessing the flip-chip assembly through CMC and an application example to demonstrate the process and benefits of flip-chip assembly.
The document is intended as a high-level introduction to the flip-chip service provided through CMC. Users must also be familiar with the CMC-supported design fabrication and test environment.
To make most effective use of the flip-chip assembly service users should understand and incorporate the rules during chip design. Some design rules will impact pad arrangement.
