Application Note: Post-Processing Techniques to Address Challenges in Die Handling; Mask Alignment; and Edge Bead Infringement

This application note describes techniques to prepare individual semiconductor die for post processing.

This document will interest researchers and engineers who wish to add sensors and other functionality to small numbers of working die, or fix processing errors on existing die.

By following the techniques discussed in this document, a user will be able to successfully attach a die to a wafer, deposit resist material, and align and pattern structures to post process the die.

All CMC Microsystem account holders with a Professor Research Subscription are authorized to access this application note. For more information contact Linda Dougherty at licensing@cmc.ca or 613-530-4787.