Developed in conjunction with Dr. Karan Kaler and Lee Hartley, Electrical and Computer Engineering, University of Calgary, this application note describes a hybrid assembly procedure for the integration of custom sensors and actuators atop glass microfluidic substrates.
This document will allow novice users of flip-chip assembly to: (1) Prepare substrate metallization. (2) Ensure adequate chip post-processing to maximize assembly yield of finished hybrids.
CMC is collaborating with researchers at Canadian universities to build a library of microsystems application notes. These documents are intended to help extend microsystems research in Canada by describing new techniques, processes, and design tools relating to microsystems, and to help stimulate new ideas that accelerate research and development activities.
