Application Note: Bonding a Silicon Electrode Array to a CMOS Chip Using a Customized Flip-Chip Process

Developed in conjunction with Prof. Roman Genov at the Department of Electrical and Computer Engineering, University of Toronto, this application note describes the flip-chip technique used by CMC to assist the study of electrical signals in the brain tissue of test animals. In the research area of medical diagnostics, there have been striking advancements in the development of recording techniques that have enabled the extraction of signals from living organs, such as the brain or nervous system.

The basic structure of the diagnostic instrument used to capture these signals involves an integrated electrodes array combined with a CMOS signal processing chip. A significant advancement in the way these types of measurements are made (with improved robustness and reduced noise) can be attributed to the flip-chip packaging method.

CMC is collaborating with researchers at Canadian universities to build a library of microsystems application notes. These documents are intended to help extend microsystems research in Canada by describing new techniques, processes, and design tools relating to microsystems, and to help stimulate new ideas that accelerate research and development activities.

All CMC Microsystems account holders with a Subscription are authorized to access this document. For more information, contact the Licensing Administrator at licensing@cmc.ca or 613-530-4787.

Application Note: Bonding a Silicon Electrode Array to a CMOS Chip Using a Customized Flip-Chip Process

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